Products & Services

Advancing 3D packaging through precision engineering, automation, and innovative process design.

High-Precision Laser Chip-to-Wafer Bonder (LAB Series)

The LAB Series is the core equipment for 3D packaging — enabling micron- to nanometer-level bonding accuracy between multiple layers of wafers or chips.

Key Features
  • Laser-assisted bonding with ultra-precise alignment
  • High thermal uniformity and throughput
  • Modular design adaptable to diverse processes
  • Perfect for 3D ICs, MEMS, and heterogeneous integration

High-Speed Non-Contact Solder Ball Placement Machine (HS-M Series)

A world-first system using flux spraying and solder ball jetting technology that eliminates the need for costly molds used by conventional machines.

Advantages
  • No tooling required
  • Saves cost and time
  • Fast product changeover
  • Easy operation and maintenance
  • Ideal for ≥40 µm solder ball applications
Technical Highlights
  • ± ball diameter accuracy
  • Intelligent flux volume control
  • Real-time head calibration

Online Ball Repair Machine (HS-R Series)

An advanced inspection and correction system for detecting and repairing missing, extra, or misaligned solder balls.

Key Features
  • Visual inspection with automated re-balling
  • Precise flux re-application
  • Supports various substrate types
  • Improves yield and reduces rework cost

Customized Modules & Automation Integration

Process module customization

Tailored solutions for specific manufacturing needs.

Robotics & conveyor system integration

Optimized automation flow and handling.

In-line inspection and MES connectivity

Smart monitoring and data integration.

Turnkey production line setup for 3D packaging

Complete solutions for high-efficiency 3D packaging.

Looking for a custom 3D packaging solution?

Talk to our experts to explore how our precision bonding and automation systems can transform your production line.
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