The LAB Series is the core equipment for 3D packaging — enabling micron- to nanometer-level bonding accuracy between multiple layers of wafers or chips.
A world-first system using flux spraying and solder ball jetting technology that eliminates the need for costly molds used by conventional machines.
An advanced inspection and correction system for detecting and repairing missing, extra, or misaligned solder balls.
This high-precision laser soldering machine is suitable for high-precision, high-density welding of micro-components. It is compatible with solder balls made of various alloy materials, including lead-free solder, high-lead solder, and gold-tin alloy solder. It handles solder ball diameters ranging from 40um to 760um, including products with ultra-tight pitch. The machine melts solder balls using laser energy and jets them under nitrogen pressure, providing highly accurate ball placement and a flexible soldering solution in low-oxygen environments. Furthermore, it requires no tooling, no flux, and no reflow, offering a low-pressure, pollution-free, and cost-effective operation that is suitable for cleanroom use with optional ESD features.
Tailored solutions for specific manufacturing needs.
Optimized automation flow and handling.
Smart monitoring and data integration.
Complete solutions for high-efficiency 3D packaging.
